Title: Amkor Technology: Semiconductor IC Test | Wafer Level Packaging | Wafer Probe | Wafer Bumping | Flip Chip | RF Design | RF Test
Description: Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the world’s leading semiconductor su
Keywords:
amkor,
amkor technology,
system in package,
unitive,
wafer bump,
wafer bumps,
flip chip,
amkor packaging,
wafer level pacakaging,
package on package,
PoP